Single-Side Conductive Copper Foil Tape for EMI/RFI Shielding - STK
STK's Single-Side Conductive Copper Foil Tape is a premium electronic-grade material designed to solve complex electromagnetic compatibility (EMC) and grounding challenges. It is engineered using a high-purity copper foil backing (>99.95%) coated with an advanced, chemically cross-linked acrylic adhesive matrix containing evenly dispersed conductive micro-particles.
Unlike standard decorative copper foils, this industrial-grade tape provides specialized single-side conductivity. This means the copper backing is fully conductive along its surface (X and Y axes), while the advanced adhesive layer also delivers excellent vertical conductivity (Z-axis continuity). When applied to an electronic substrate, it establishes an instantaneous and reliable electrical connection through the bond line, making it a critical component for EMI/RFI shielding applications in electronics.
Technical Specifications
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Product Name |
Conductive Copper Foil Tape |
Conductive Copper Foil Tape |
Conductive Copper Foil Tape |
Conductive Copper Foil Tape |
Conductive Copper Foil Tape |
Conductive Copper Foil Tape |
Tin-Plating copper foil tape |
|
|
Backing |
Copper foil/ Nano Carbon copper foil |
Copper foil/ Nano Carbon copper foil |
Copper foil/ Nano Carbon copper foil |
Copper foil/ Nano Carbon copper foil |
Copper foil/ Nano Carbon copper foil |
Copper foil/ Nano Carbon copper foil |
Copper foil |
|
|
TotalThickness |
0.02 |
0.03 |
0.05 |
0.06 |
0.07 |
0.09 |
0.12 |
|
|
Copper foil Thickness(mm) |
0.009 |
0.009 |
0.018 |
0.025 |
0.035 |
0.05 |
0.045 |
|
|
Peel Adhesion |
1.2 |
1.2 |
1.2 |
1.2 |
1.2 |
1.2 |
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|
Surface Resistance(Ω) |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.03 |
|
|
Holding power |
48 |
48 |
48 |
48 |
48 |
48 |
48 |
|
|
Short-term temperature( ℃) |
120 |
120 |
120 |
120 |
120 |
120 |
250 |
|
|
Long-term temperature( ℃) |
80 |
80 |
80 |
80 |
80 |
80 |
220 |
|
|
Remark |
Single side conductive and double side conductive as optional |
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Advanced EMI/RFI Shielding & Grounding for High-Density Electronics
As electronic assemblies become increasingly compact and high-frequency, mitigating internal noise becomes a primary engineering constraint. STK's Conductive Copper Tape targets these exact vulnerabilities:
Uncompromising EMI/RFI Shielding
The dense, high-purity copper backing acts as an excellent Faraday cage, reflecting and absorbing airborne electromagnetic waves (EMI) and radio frequency interference (RFI) across a frequency range of 30 MHz to 1 GHz.
Static Dissipation & Reliable Grounding
Quickly drains accumulated static charges and provides a low-resistance path to ground for delicate printed circuit boards (PCBs) and flexible circuits (FPCs).
Display Component Integration
Ideal for grounding and shielding internal electronics within PAD, PDP, LCD screens, and laptops, isolating sensitive drivers from ambient radio signals.
Excellent Conformability
The dead-soft copper foil adapts seamlessly to tight angles, contours, and complex metal housings without cracking or lifting away at the edges.
Alternatives / Comparison
Brand Alternatives
Equivalent to: 3M 1181 Copper Foil Shielding Tape
Comparable to: tesa conductive copper foil tape
Comparable to: Nitto EMI shielding copper tape
Comparison Logic
Same copper foil backing with conductive adhesive system
Designed for EMI shielding, grounding, and static discharge applications
Similar conductivity and shielding effectiveness performance
Cost-Effective Alternatives
Factory direct copper foil tapes provide:
Cost savings of approximately 30%–60%
Custom widths, lengths, and die-cut formats
Conductive and non-conductive adhesive options
OEM / private label packaging
Equipment
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