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Empowering Electronics, IoT & AI Smart Devices with Advanced Bonding Solutions As consumer electronics continue to evolve toward thinner, light...

On January 6, 2026, the 10th Anniversary Conference of the Shenzhen Lighting & Display Engineering Industry Association (SLDA), themed "Light t...

tesa has officially launched the tesa® MP+ 88676 PET Double-Sided Tape , a next-generation bonding solution specifically engineered for low sur...

3M to Unveil Semiconductor Chip Adhesive Solutions Highlighted at the 2026 (3rd) Semiconductor, Sensor & Emerging High-End Electronics Adhesive...

STK Tape Produces 50 Million m² Annually, Setting a New Benchmark for Domestic Fiber Tapes Step into the modern manufacturing base of STK Tape...

Innovative Sealing Tape Helps Airlines Reduce Costs and Improve Efficiency Ensuring the safety and comfort of every flight requires airlines to inv...

STK's Eco-Friendly UV Adhesive Tape Accelerates Industry Upgrading As the electronics industry rapidly advances toward greater precision and mi...

At the renowned Munich Electronics Production Equipment Exhibition, Tesa Tape, in partnership with Cellios, launched a groundbreaking fully automat...

During the 8th China International Import Expo (CIIE) in 2025, global materials leader Dow and technology-driven innovator 3M China officially sign...

As the electronics industry continues to move toward higher precision and miniaturization, new-generation devices such as XR wearables, VR/AR heads...

Last week, the 2025 Shenzhen International Film & Tape Expo - known as the "Canton Fair of the tape industry" - came to a successful ...

A research team led by Prof. Huang Xingyi and Dr. Shi Kunming from Shanghai Jiao Tong University has developed a multilayer thermally conductive an...