3M to Unveil Semiconductor Chip Adhesive Solutions
Highlighted at the 2026 (3rd) Semiconductor, Sensor & Emerging High-End Electronics Adhesive Innovation Forum
As China's semiconductor, sensor, and emerging high-end electronics industries continue to move toward higher integration, miniaturization, and performance density, adhesive materials have become a critical enabler in advanced electronic manufacturing. From chip assembly and thinning to thermal management, bonding solutions now play a decisive role in product reliability, yield, and long-term stability.
Against this backdrop, the 2026 (3rd) Semiconductor, Sensor & Emerging High-End Electronics Adhesive Innovation Forum will be held on January 7–8, 2026, in Shenzhen, China. The forum is jointly organized by STK Tape, the New Materials Industry Alliance, and the Shenzhen Intelligent Sensor Industry Association, among others.
Building on the successful editions held in 2023 and 2024, this year's forum aims to deliver in-depth insights into market trends, application challenges, and technological breakthroughs in high-end electronic adhesive materials, supporting the high-quality development of China's advanced electronics ecosystem.
Global Adhesive Leader 3M to Deliver a Keynote Presentation
"3M Adhesive Solutions for Semiconductor Chips"
The forum organizers are honored to welcome 3M China Co., Ltd., a global leader in adhesive and functional material technologies, as a key participant of the event.
Dr. Liu Wei,
Senior Market Development Manager, Greater China, 3M China,
has been invited to deliver a featured technical presentation titled:
"3M Adhesive Solutions for Semiconductor Chips"
Speaker Profile | Dr. Liu Wei
19 years of experience at 3M
Senior Market Development Manager, Greater China (6 years)
Senior Tape & Adhesive Technology Expert for Asia-Pacific (14 years)
Extensive experience in product development, process development, scale-up manufacturing, and application engineering
Dr. Liu is widely recognized for his ability to identify emerging trends in the electronics market and translate advanced material technologies into practical, system-level bonding solutions across the electronic assembly value chain. He continuously integrates the latest technological advancements into actionable adhesive strategies for semiconductor and high-end electronic applications.
Key Topics of the Presentation
Dr. Liu's presentation will focus on adhesive technologies supporting advanced semiconductor packaging and high-performance computing applications, including:
Adhesives for Semiconductor Chip Assembly
Key bonding challenges in chip, wafer, and package-level assembly
High-reliability adhesive solutions for precision electronics manufacturing
Adhesives for Chip Thinning and Temporary Bonding Processes
Material solutions for thinning, fixation, and debonding processes
Improving yield and process stability in advanced semiconductor manufacturing
Thermal Management Adhesive Solutions for High-Performance Chips
Adhesive and bonding materials for AI and high-computing-power chips
Balancing high thermal conductivity, low stress, and long-term reliability
About 3M China
Founded in 1984, 3M China Co., Ltd. is one of the few companies globally capable of providing integrated solutions covering tapes, adhesives, and adhesive automation systems.
3M's presence in China includes:
9 manufacturing sites
20 branch offices
4 technical centers and 1 R&D center
Nearly 8,000 employees
Founded in 1902 in the United States, 3M is a global diversified technology company and a benchmark in functional materials innovation.
FY2024 global revenue: USD 24.575 billion
FY2024 net profit: USD 4.009 billion
Jan–Sep 2025 performance:
Revenue: RMB 18.815 billion
Net profit: USD 2.673 billion
Addressing Industry Challenges and Shaping the Future of Electronics Adhesives
The 2026 forum will directly address the latest market demands and technical challenges in semiconductor, sensor, robotics, and other emerging high-end electronic applications. It will focus on the key pain points, innovation opportunities, and application scenarios that adhesive material companies care most about.
As a professional adhesive tape solution provider serving electronics and industrial customers worldwide, STK Tape continues to closely track global technology leaders such as 3M. By translating cutting-edge material innovations into practical, application-driven bonding solutions, STK Tape is committed to supporting the next generation of high-end electronic manufacturing.
Event Details
�� Date: January 7–8, 2026
�� Location: Shenzhen, China
�� Event: 2026 (3rd) Semiconductor, Sensor & Emerging High-End Electronics Adhesive Innovation Forum
