High-Temperature Ultra-Thin Polyimide Film (0.025 mm - 0.075 mm) for Micro-Electronics - STK
STK's High-Temperature Ultra-Thin Polyimide Film is an elite-grade dielectric substrate material engineered to meet the rigorous structural isolation requirements of next-generation microelectronics and high-density semiconductor packaging. Manufactured from ultra-stable polyimide resin, this Kapton-type film provides an ultra-low profile insulation layer while maintaining strong thermal resistance and electrical isolation performance.
With a tightly controlled thickness range of 0.025 mm to 0.075 mm, this technical film functions as a permanent high-temperature insulation layer. It enables hardware design engineers to achieve reliable electrical decoupling and thermal protection in highly compact device architectures where conventional films or tapes would be too thick or structurally limiting.
Upload Your CAD/PDF Blueprint for a Precise Die-Cut Prototype
In the highly competitive consumer electronics sector (5G smartphones, smart wearables, IoT sensors, and flexible OLED modules), internal space is constrained at micron-level tolerances. Conventional insulation films or thicker carrier structures can limit stacking density and thermal design efficiency. STK's ultra-thin polyimide film provides a dedicated solution for ultra-compact architectures:
Extreme Space-Saving Micro Insulation
With an ultra-low profile thickness down to 0.025 mm / 0.03 mm, this film enables multi-layer component stacking in confined electronic assemblies without adding vertical bulk or restricting thermal airflow paths.
High-Voltage Dielectric Integrity
Despite its minimal thickness, the dense polyimide structure provides strong electrical isolation, with dielectric strength exceeding 5 kV per mil, helping prevent localized breakdown and short-circuit risks under high-density current conditions.
Thermal Stability & Dimensional Rigidity
Designed for compatibility with SMT reflow processes, hot-bar bonding, and thermal cycling up to 260°C (500°F), maintaining dimensional stability without shrinkage, curling, or deformation.
Technical Specifications
| Item | Spec A | Spec B | Spec C | Spec D | Spec E (ESD Type) |
|---|---|---|---|---|---|
| Product Description | Polyimide Film | Polyimide Film | Polyimide Film | Polyimide Film | ESD Polyimide Film |
| Thickness (mm) | 0.025 | 0.038 | 0.05 | 0.075 | 0.06 |
| Carrier Material | Polyimide Film | Polyimide Film | Polyimide Film | Polyimide Film | Polyimide Film |
| Color | Amber / Black | Amber / Black | Amber / Black | Amber / Black | Amber / Black |
| Release Liner | None | None | None | None | None |
| Elongation at Break (%) | 25% – 55% | 25% – 55% | 25% – 55% | 25% – 55% | 25% – 55% |
| Dielectric Strength (MV/m) | 150 | 180 | 180 | 200 | 200 |
| Surface Resistivity (Ω/in²) | 10^13 – 10^15 | 10^13 – 10^15 | 10^13 – 10^15 | 10^13 – 10^15 | 10^13 – 10^13 |
| Short-Term Temperature Resistance (°C) | 350 | 350 | 350 | 350 | 350 |
| Continuous Operating Temperature (°C) | 300 | 300 | 300 | 300 | 300 |
Primary Micro-Electronic Application Fields
STK's ultra-thin polyimide film serves as a mission-critical raw material across high-density assembly lines:
Flexible Printed Circuit (FPC) Base Insulator: Serving as the core dielectric base film layer or coverlay substrate inside multi-layer flexible circuit stacks.
Smart Device Battery Insulation: High-heat perimeter outer wrap isolation and internal terminal barrier strips for lithium-polymer pouch cells inside ultra-thin smartphones and tablets.
Micro-Sensor & Acoustic Modules: Providing underlying electrical isolation inside miniature voice coils, haptic vibration motors, and micro-camera sensor modules.
OLED & Touch Panel Shielding: Essential dielectric isolation and static-mitigation layer directly behind thin-film transistor (TFT) display substrates.
B2B Factory Processing Strength: Precision Die-Cutting with Tight Tolerances
For smart hardware OEMs and electronics manufacturing service (EMS) providers, raw master rolls must be converted into high-precision, assembly-ready components. STK leverages advanced slitting and cleanroom die-cutting capabilities to directly improve production yield and line efficiency:
CAD/PDF Custom Silhouette Engineering:
Send us your engineering schematics. Using high-speed rotary presses and automated laser plotting systems within certified Class 1000 dust-free cleanrooms, we manufacture micro-gaskets, intricate frame windows, and sub-millimeter polyimide insulation spacers.
Guaranteed Burr-Free, Sharp Edges:
Advanced tooling design ensures clean, burr-free cutting edges with zero deformation, reducing the risk of component jamming in automated pick-and-place and SMT assembly systems.
Tailored Formats & Release Liner Integration:
We supply ultra-thin polyimide film in slit rolls, master sheets, or custom die-cut shapes mounted on high-stability PET release liners, significantly reducing manual handling time and improving assembly line throughput.
Equipment
Why Choose Our Ultra-Thin Double Sided Polyimide Tape?
Our tape is manufactured to the highest industry standards, ensuring consistency, reliability, and performance. It is the preferred choice for engineers and designers who require a lightweight, high-strength bonding solution for cutting-edge applications.
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