Copper Clad Polyimide (FCCL) for Flexible Printed Circuits (FPC) | EMI Shielding - STK
Copper Clad Polyimide, also known as Flexible Copper Clad Laminate (FCCL), is a high-performance composite material consisting of polyimide film bonded with copper foil. It serves as the fundamental substrate for the Flexible Printed Circuit (FPC) industry.
At STK, our FCCL(Copper Clad Polyimide Film 0.05) is engineered to meet the rigorous demands of modern micro-electronics. By combining the exceptional thermal stability of Polyimide with the high conductivity of electrolytic or rolled annealed copper, we provide a material that supports high-density circuitry, excellent bendability, and superior signal integrity. Whether for 5G telecommunications, aerospace, or medical devices, our FCCL ensures your circuits perform under extreme thermal and mechanical stress.
Materials for Flexible Printed Circuits (FPC)
The evolution of thinner, lighter, and more powerful devices requires FPC materials that offer more than just insulation. STK's Copper Clad Polyimide is specifically optimized for:
High-Density Interconnects (HDI): Providing the dimensional stability required for fine-pitch etching and multi-layer FPC stacking.
EMI Shielding & Signal Integrity: The uniform copper layer acts as a robust barrier against Electromagnetic Interference (EMI), crucial for high-frequency 5G signal transmission and sensitive medical sensors.
Extreme Bendability: Our FCCL maintains electrical continuity even after thousands of flex cycles, making it ideal for foldable smartphones, wearable tech, and dynamic robotic joints.
Technical Specifications
| Test Item | Standard |
|---|---|
| Volatile Matter Content (%) ≤ | 3 |
| Dimensional Stability (X, Y Axis) (%) ≤ | 0.20 |
| Peel Strength (N/mm) ≥ | 0.7 |
| Soldering Resistance (290°C, 10s) No delamination, no blistering | Pass |
| Surface Resistance (MΩ) ≥ | 1×10⁵ |
| Dielectric Constant ≤ | 4.0 |
| Dissipation Factor ≤ | 0.035 |
Key Features
Dual Function: Insulation + Conductivity
Polyimide layer provides high-temperature insulation while copper layer enables electrical conductivity and shielding.
01
High Temperature Resistance (Up to 260°C+)
Polyimide base maintains stability during soldering and electronic processing without deformation
02
Excellent EMI Shielding Performance
Copper layer effectively reduces electromagnetic interference, improving signal stability in electronic devices.
03
Flexible for FPC Applications
Designed for flexible printed circuits with excellent bendability and mechanical strength
04
Strong Chemical & Corrosion Resistance
Resistant to solvents, acids, and harsh industrial environments, ensuring long-term reliability
05
Application:
Flexible PCB (FPC) Manufacturing
Used as base or reinforcement material in flexible printed circuits, ensuring signal integrity and mechanical flexibility.
EMI Shielding & Electronic Protection
Applied in electronic devices, cables, and components to reduce electromagnetic interference and improve performance.
Why Source FCCL from STK?
Direct Factory Capacity
With 4 production bases, we offer the supply chain security required for high-volume electronic manufacturing.
Clean Room Production
All FCCL materials are processed in Class 1000 clean rooms to ensure zero dust contamination, preventing circuit defects.
Wholesale Tiered Pricing
Save 30%–50% on material costs by sourcing directly from the manufacturer. We support both prototype sampling and mass-production volumes.
Equipment
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