TESA HAF 8410 HS Heat Activated Film | Structural High-Speed Bonding Tape - Genuine TESA - STK
STK's Genuine TESA HAF 8410 HS (High Speed) is an ultra-thin thermosetting bonding film made from reactive phenolic resin and nitrile rubber, protected with a paper liner. It remains non-tacky at room temperature and activates under heat and pressure to create a permanent, high-strength structural bond.
Compared with traditional liquid adhesives, TESA HAF 8410 HS provides cleaner processing, consistent thickness, and faster assembly efficiency. Designed for high-speed automated production, it offers short activation time, excellent shear strength, and strong impact resistance, making it ideal for compact electronic components and precision assembly applications.
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Product Features
Reliable Chip Module Bonding
Engineered specifically for embedding chip modules into smart cards with strong and durable structural bonding performance.
01
High-Speed Processing Performance
Optimized for high-speed automated implanting lines with short activation cycles and efficient heat bonding.
02
Excellent Ageing Resistance
Maintains stable bonding performance over long-term use with strong resistance to ageing.
03
Lifelong Flexibility
High nitrile rubber content keeps the bond flexible after curing, helping reduce stress cracking in card applications.
04
Easy Converting
Non-tacky at room temperature, making it easy for slitting, die-cutting, handling, and automated processing.
05
TDS
Product Construction
|
Adhesive Type |
nitrile rubber / phenolic resin |
|
Backing material |
none |
|
Color |
amber |
|
Liner Type |
glassine |
|
Total thickness |
60 µm |
Properties / Performance Values
|
Bonding strength (push-out) |
12 N/mm² |
|
Bonding strength (dynamic shear) |
12 N/mm² |
Products Applications
Smart Card & Dual-Interface Chip Inlay Bonding: Embedding microchips and antenna contacts securely into polycarbonate or PVC smart cards, credit cards, and secure ID modules.
Consumer Electronics & Wearable Assemblies: Structural bonding of internal brackets, metal camera rings, antenna flex-circuits, and display windows inside smartphones, tablets, and smartwatches.
Automotive Sensor & Electronic Components: Bonding component parts inside electronic control units (ECUs), sensor housings, and heating elements subject to harsh under-hood thermal cycles.
Precision Industrial Fabric Lamination: High-strength bonding of thin metal plates, decorative foils, or synthetic materials in premium architectural and aerospace interiors.
B2B Volume Supply Capabilities: Precision Die-Cutting & Custom Millimeter Slitting
Advanced Dust-Free Cleanroom Die-Cutting: Operating high-precision rotatory and flatbed die-cutting machinery inside class-certified cleanrooms, STK processes TESA HAF 8410 HS master logs into exact custom-engineered stamp pieces, narrow strips, or complex hollow gaskets on rolls, ready for pick-and-place automation.
Precision Narrow Log Slitting: We split original master logs into precise custom widths down to 3mm or less with extremely smooth, burr-free edges, eliminating winding friction and web-breakage on your automated thermal bonding lines.
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