Genuine 3M™ Scotch-Weld™ DP460 EG Epoxy Adhesive | High-Strength Low Outgassing Electronics Grade Glue - STK
STK supplies Genuine 3M Scotch-Weld Epoxy Adhesive DP460, a premium, high-performance two-part structural adhesive formulated specifically for extreme-reliability microelectronics, hard disk drive (HDD) manufacturing, and aerospace electronics assembly. Based on 3M's legendary high-strength DP460 formula, this "EG" (Electronics Grade) variation underwent severe chemical purification to eliminate harmful ionic and volatile contaminants.
The defining engineering milestone of 3M DP460 EG is its strict compliance with ultra-low outgassing and ultra-low chloride standards. It forms an armored, vibration-proof structural weld that locks high-value electronic components, sensors, and micro-substrates together without risking chemical corrosion or organic outgassing contamination over decades of service.
Key Features
High Structural Strength
Excellent bonding for metals, plastics, and composites under mechanical stress.
01
Electronic Grade
Low ionic contamination and minimal outgassing, suitable for sensitive electronic assemblies.
02
Impact & Thermal Resistance
Maintains bond integrity under thermal cycling and vibration.
03
Versatile Curing Options
Room temperature cure or accelerated heat cure for faster production cycles.
04
Technical Specifications
|
Adhesive Type |
Epoxy |
|
Application |
Impact Resistance |
|
Brands |
Scotch-Weld™ |
|
Design Challenges |
Impact & Shock Absorption, Noise Vibration & Harshness Control NVH |
|
Full Cure Time |
24 Hours @ 73 F (23 C) |
|
Hardness |
77 Shore D, 75 - 80 Shore D |
|
Industries |
Construction, Consumer Goods, Electronics, General Industrial, MRO, Metalworking, Military & Government, Signage, Specialty Vehicles, Transportation, Woodworking |
|
Mix Ratio Volume Base:Accelerator |
2:1 |
|
Open Time |
60 min |
|
Performance Level |
Best |
|
Physical Form |
Flowable Liquid, Liquid, Paste |
|
Product Form |
Cartridge, Each, Kit |
|
Set Time |
4 hr |
|
Shear Strength |
4500 psi |
|
Smallest Saleable Unit |
Canister, Drum, Each, Kit, Pack |
|
Specific Gravity |
1.08, 1.09, 1.12, 1.14 |
|
Specifications Met |
UL 94 HB, ASTM E662, Bombardier SMP 800-C |
|
Storage Temperature (Celsius) |
22 °C, 15°C - 27°C |
|
Storage Temperature (Fahrenheit) |
72 Degree Fahrenheit |
|
Surface Type |
Painted, Powder Coated, Smooth, Unpainted |
|
Time to Handling Strength |
4 hr |
Applications
Hard Disk Drive (HDD) Component Bonding: Securing read/write head armatures, voice coil motor (VCM) plates, and micro-magnets inside pristine cleanroom environments.
Aerospace & Military Electronics: Potting and structurally adhering sensor modules, navigation computer housings, and communications brackets subjected to brutal high-vibration g-forces.
PCB & Semiconductor Assembly: Mounting ceramic substrates, heat sinks, and structural metal pins onto complex printed circuit boards without chemical vapor cross-contamination.
Optical & Laser Hardware Encapsulation: Bonding lens holders, fiber-optic transceiver housings, and camera sensor frames where outgassing condensates would ruin performance.
Equipment
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